TECHBOND GROUP BERHAD
(Bursa: 5289)

0.400 [c] s

-0.005 (-1.23%)
价格区间 0.400 - 0.405   (1.25%)
开盘 0.405
昨收 0.405
买 0.395
买盘 ('00) 980
卖 0.410
卖盘 ('00) 1,143
成交量 ('00) 9,170
成交额 367,101
注释 [c] s
数据延迟。最后一次更新15 Nov 2024 17:31.
数据提供商

未来大事

AGM

会议日期 27 November 2024
会议时间 10:00 AM
Danau 3, Kota Permai Golf & Country Club, No. 1, Jalan Anggerik Vanilla 31/100A, Kota Kemuning 40460 Shah Alam, Selangor Darul Ehsan Malaysia

Dividend

除权日 20 November 2024
登记日 21 November 2024
支付日 06 December 2024
First Interim Single Tier Dividend of 1 sen per share for the financial year ending 30 June 2025.
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